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US Patent 10170639 3D memory

Patent 10170639 was granted and assigned to Micron Technology on January, 2019 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Micron Technology
Micron Technology
Current Assignee
Micron Technology
Micron Technology
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10170639
Patent Inventor Names
Srikant Jayanti0
Fatma Arzum Simsek-Ege0
James Brighten0
John Hopkins0
Aurelio Giancarlo Mauri0
Darwin Franseda Fan0
Date of Patent
January 1, 2019
Patent Application Number
14987147
Date Filed
January 4, 2016
Patent Citations Received
‌
US Patent 12114500 Integrated structures and methods of forming vertically-stacked memory cells
0
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US Patent 10355008 Floating gate memory cells in vertical memory
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US Patent 10529776 Cell pillar structures and integrated flows
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US Patent 10573721 Devices and methods including an etch stop protection material
0
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US Patent 10847527 Memory including blocking dielectric in etch stop tier
0
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US Patent 11043534 Cell pillar structures and integrated flows
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US Patent 11665893 Methods and apparatuses having strings of memory cells including a metal source
0
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US Patent 11374012 Semiconductor device and driving method of semiconductor device
0
...
Patent Primary Examiner
‌
Ahmed Sefer
Patent abstract

Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

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