US Patent 10359391 Sensor with a membrane having full circumferential adhesion

Embodiments are directed to a chemical sensor and a method of fabricating a chemical sensor that includes a membrane having full circumferential adhesion. The chemical sensor device includes a silicon substrate comprising a sensor-side and a backside. The sensor-side includes a sensor-side electrode; a first passivation layer disposed on the substrate; and a second passivation layer on the first passivation layer and adjacent to the sensor-side electrode, the passivation layer comprising an adhesion trench exposing a portion of the first passivation layer, and a polyimide ring disposed on the second passivation layer. The backside includes a backside electrode on the backside of the substrate. The substrate includes an electrically isolated doped region, such as a through silicon via, electrically connecting the sensor-side electrode and the backside electrode.