Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 19, 2019
Patent Application Number
15825263
Date Filed
November 29, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes electrically joining two or more semiconductor chips to a silicon bridge chip, and electrically joining the two or more semiconductor chips to a substrate structure, the silicon bridge chip extends into a recess in the substrate structure such that a top surface of the silicon bridge chip is substantially flush with a top surface of the substrate structure.
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