Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Srinivas V. Pietambaram0
Rahul N. Manepalli0
Date of Patent
January 12, 2021
0Patent Application Number
163057330
Date Filed
July 1, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Disclosed is an embedded multi-die interconnect bridge (EMIB) substrate. The EMIB substrate can comprise an organic substrate, a bridge embedded in the organic substrate and a plurality of routing layers. The plurality of routing layers can be embedded within the bridge. Each routing layer can have a plurality of traces. Each of the plurality of routing layers can have a coefficient of thermal expansion (CTE) that varies from an adjacent routing layer.
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