Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yen Hsiang Chew0
Date of Patent
March 15, 2022
Patent Application Number
15396530
Date Filed
December 31, 2016
Patent Citations
Patent Primary Examiner
Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies.
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