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US Patent 11447865 Deposition of low-κ films

Patent 11447865 was granted and assigned to Applied Materials on September, 2022 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Applied Materials

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

114478650

Patent Inventor Names

Shuaidi Zhang0

Bhaskar Jyoti Bhuyan0

Thomas Knisley0

Mark Saly0

Ning Li0

Mihaela A. Balseanu0

Date of Patent

September 20, 2022

Patent Application Number

169500960

Date Filed

November 17, 2020

Patent Citations

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US Patent 10023958 Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors

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US Patent 10134583 Methods of forming a low-k dielectric layer and methods of fabricating a semiconductor device using the same

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US Patent 10134617 Wafer carrier having thermal cover for chemical vapor deposition systems

Patent Citations Received

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US Patent 11970777 Deposition of low-k films

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