US Patent 11637002 Methods and systems to enhance process uniformity
Patent 11637002 was granted and assigned to Applied Materials on April, 2023 by the United States Patent and Trademark Office.
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US Patent 11637002 Methods and systems to enhance process uniformity
Article
A semiconductor processing chamber may include a remote plasma region, and a processing region fluidly coupled with the remote plasma region. The processing region may be configured to house a substrate on a support pedestal. The support pedestal may include a first material at an interior region of the pedestal. The support pedestal may also include an annular member coupled with a distal portion of the pedestal or at an exterior region of the pedestal. The annular member may include a second material different from the first material.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116370020
Date of Patent
April 25, 2023
0Patent Application Number
145542500
Date Filed
November 26, 2014
0Patent Citations
Patent Primary Examiner
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