Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 13, 2008
Patent Application Number
11230101
Date Filed
September 19, 2005
Patent Primary Examiner
Patent abstract
A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
