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US Patent 7419864 Semiconductor device and method of manufacturing the same

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Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
74198641
Patent Inventor Names
Narumi Ohkawa1
Masaya Katayama1
Date of Patent
September 2, 2008
1
Patent Application Number
118823551
Date Filed
August 1, 2007
1
Patent Primary Examiner
‌
Hoai V Pham
1
Patent abstract

A semiconductor device includes a first n-type source/drain region 48a and a second p-type source/drain region 48b formed on a semiconductor substrate 20 away from side surfaces of first and second gate electrodes 39a, 39b at a first interval W4 respectively, a second n-type source/drain region 48c and a first p-type source/drain region 48d formed on the semiconductor substrate 20 away from side surfaces of third and fourth gate electrodes 39c, 39d at a second interval W3, which is wider than the first interval W4, respectively, and third and fourth insulating sidewalls 43c, 43d extended onto source/drain extensions 42c, 42d on both sides of third and fourth gate electrodes 39c, 39d from edges of upper surfaces of the third and fourth gate electrodes 39c, 39d respectively.

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