Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 22, 2009
Patent Application Number
11676097
Date Filed
February 16, 2007
Patent Primary Examiner
Patent abstract
A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack of hardware boards. The desired functionality is then transmitted to a board in the stack of hardware boards and the board is configured to implement the desired functionality of the stack of hardware boards.
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