US Patent 9670445 Microfluidics sensor package fabrication method and structure

A microfluidics sensor package includes a microfluidics sensor die having an active surface, bond pads on the active surface, and an active area on the active surface. A standoff pattern is formed on the active surface to extend to a precise height above the active surface. A lid is mounted to the standoff pattern by a lid adhesive. By using the standoff pattern to precisely space the lid above the active surface, a microfluidics cavity between the lid and the active surface is precisely created allowing for precise control of fluid flowing through the microfluidics cavity. By precisely controlling the flow of fluid through the microfluidics cavity, accurate results, e.g., of the laboratory functions performed on the fluid, are provided.