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Anh Duy Mai

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Edits on 14 Dec, 2021
"Remove inverse infobox"
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edited on 14 Dec, 2021
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Infobox (-18 properties)
Infobox
Patent primary examiner of
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US Patent 7091093 Method for fabricating a semiconductor device having a pocket dopant diffused layer
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US Patent 7098474 Organic electroluminescent device having a thin film formed by plasma on a surface of a hole injection layer
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US Patent 7109527 Semiconductor chip for optoelectronics and method for production thereof
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US Patent 7118979 Method of manufacturing transistor having germanium implant region on the sidewalls of the polysilicon gate electrode
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US Patent 7138657 Semiconductor device having two insulating films provided over a substrate
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US Patent 7166883 Capacitor structures
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US Patent 7193252 Solid-state imaging device and solid-state imaging device array
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US Patent 7193275 Semiconductor device allowing modulation of a gain coefficient and a logic circuit provided with the same
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US Patent 7208408 Method for fabricating a dual damascene contact in an insulating film having density gradually varying in the thickness direction
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US Patent 7235456 Method of making empty space in silicon
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US Patent 7253458 CMOS image sensor
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US Patent 7253484 Low-power multiple-channel fully depleted quantum well CMOSFETs
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US Patent 7265014 Avoiding field oxide gouging in shallow trench isolation (STI) regions
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US Patent 7271498 Bump electrodes having multiple under ball metallurgy (UBM) layers
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US Patent 7273808 Reactive barrier/seed preclean process for damascene process
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US Patent 7276774 Trench isolation structures for integrated circuits
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US Patent 7279357 Method for fabricating a chip-scale-packaging (CSP) having an inductor
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US Patent 7297570 Complementary metal oxide semiconductor image sensor and method for fabricating the same
Edits on 23 Nov, 2021
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7297570 Complementary metal oxide semiconductor image sensor and method for fabricating the same
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7279357 Method for fabricating a chip-scale-packaging (CSP) having an inductor
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7276774 Trench isolation structures for integrated circuits
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7273808 Reactive barrier/seed preclean process for damascene process
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7271498 Bump electrodes having multiple under ball metallurgy (UBM) layers
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7265014 Avoiding field oxide gouging in shallow trench isolation (STI) regions
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7253484 Low-power multiple-channel fully depleted quantum well CMOSFETs
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7253458 CMOS image sensor
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7235456 Method of making empty space in silicon
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Golden AI
edited on 22 Nov, 2021
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Golden AI
edited on 22 Nov, 2021
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7193252 Solid-state imaging device and solid-state imaging device array
Edits on 21 Nov, 2021
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Golden AI
edited on 21 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7166883 Capacitor structures
Edits on 19 Nov, 2021
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Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7138657 Semiconductor device having two insulating films provided over a substrate
Edits on 17 Nov, 2021
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Golden AI
edited on 17 Nov, 2021
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Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7109527 Semiconductor chip for optoelectronics and method for production thereof
Edits on 17 Nov, 2021
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Golden AI
edited on 17 Nov, 2021
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Golden AI
edited on 16 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7091093 Method for fabricating a semiconductor device having a pocket dopant diffused layer
"Created via: Entity Importer"
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created this topic on 16 Nov, 2021
Edits made to:
Infobox (+2 properties)
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 Anh Duy Mai

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Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

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