Other attributes
Classification Type
Parent Classification
No article content yet.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
C09J 2203/326
Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Find more entities like C09J 2203/326
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
