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Dale E Page

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Edits on 14 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 14 Dec, 2021
Edits made to:
Infobox (-8 properties)
Infobox
Patent primary examiner of
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US Patent 11177140 3D semiconductor device and structure
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US Patent 11177169 Interconnects with gouged vias
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US Patent 11177242 Semiconductor device including magnetic hold-down layer
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US Patent 11180362 Method for processing a layer structure and microelectromechanical component
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US Patent 11183495 Power semiconductor devices
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US Patent 11187602 Device and method for pressure force inspection
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US Patent 11189490 Method of manufacturing a semiconductor device and a semiconductor device
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US Patent 11189582 Wire bond pad design for compact stacked-die package
Edits on 2 Dec, 2021
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Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11189582 Wire bond pad design for compact stacked-die package
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Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11189490 Method of manufacturing a semiconductor device and a semiconductor device
Golden AI profile picture
Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11187602 Device and method for pressure force inspection
Edits on 25 Nov, 2021
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Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11183495 Power semiconductor devices
Golden AI profile picture
Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11180362 Method for processing a layer structure and microelectromechanical component
Edits on 19 Nov, 2021
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Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11177242 Semiconductor device including magnetic hold-down layer
Golden AI profile picture
Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11177169 Interconnects with gouged vias
Golden AI profile picture
Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11177140 3D semiconductor device and structure
"Created via: Entity Importer"
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Golden AI
created this topic on 19 Nov, 2021
Edits made to:
Infobox (+2 properties)
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 Dale E Page

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Is a
Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

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