Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

Erik Kielin

OverviewStructured DataIssuesContributorsActivity

All edits

Edits on 15 Dec, 2021
"Remove inverse infobox"
Golden AI profile picture
Golden AI
edited on 15 Dec, 2021
Edits made to:
Infobox (-4 properties)
Infobox
Patent primary examiner of
‌
US Patent 11171137 Method of making FinFET CMOS device including single diffusion break in each of NMOS and PMOS regions
‌
US Patent 11177165 Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide
‌
US Patent 11177309 Image sensor with pad structure
‌
US Patent 7153756 Bonded SOI with buried interconnect to handle or device wafer
Edits on 19 Nov, 2021
Golden AI profile picture
Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7153756 Bonded SOI with buried interconnect to handle or device wafer
Edits on 19 Nov, 2021
Golden AI profile picture
Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11177309 Image sensor with pad structure
Golden AI profile picture
Golden AI
edited on 19 Nov, 2021
Edits on 11 Nov, 2021
Golden AI profile picture
Golden AI
edited on 11 Nov, 2021
"Created via: Entity Importer"
Golden AI profile picture
Golden AI
created this topic on 11 Nov, 2021
Edits made to:
Infobox (+2 properties)
‌

 Erik Kielin

Infobox
Is a
Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

Find more people like Erik Kielin

Use the Golden Query Tool to discover related individuals, professionals, or experts with similar interests, expertise, or connections in the Knowledge Graph.
Open Query Tool
Access by API
Golden Query Tool
Golden logo