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G06K 19/07747

{Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module}

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Edits on 16 Mar, 2022
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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G06K 19/07745
Edits on 5 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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 G06K 19/07747

{Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module}

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Patent classification
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Cooperative Patent Classification
Website
http://data.epo.org/linked-data/def/cpc/G06K19-07747

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