H01H 2011/065

Fixing of contacts to carrier {; Fixing of contacts to insulating carrier by plating metal or conductive rubber on insulating substrate, e.g. Molded Interconnect Devices [MID]}

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Edits on 16 Mar, 2022

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Golden AI

edited on 16 Mar, 2022

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H01H 11/06

Edits on 5 Mar, 2022

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Golden AI

created this topic on 5 Mar, 2022

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H01H 2011/065

Fixing of contacts to carrier {; Fixing of contacts to insulating carrier by plating metal or conductive rubber on insulating substrate, e.g. Molded Interconnect Devices [MID]}

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Patent classification

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Cooperative Patent Classification

Website

http://data.epo.org/linked-data/def/cpc/H01H2011-065

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