Other attributes
Classification Type
Parent Classification
No article content yet.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
H01L 21/447
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups [CPC: H01L21/38] - [CPC: H01L21/428] involving the application of pressure, e.g. thermo-compression bonding
Find more entities like H01L 21/447
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
