H01L 21/68707

Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere } for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches {the wafers being placed on a robot blade, or gripped by a gripper for conveyance}