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H01L 21/7688

{Filling of holes, grooves or trenches, e.g. vias, with conductive material by deposition over sacrificial masking layer, e.g. lift-off }

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Edits on 16 Mar, 2022
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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Parent classification
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H01L 21/76877
Edits on 5 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
Edits made to:
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 H01L 21/7688

{Filling of holes, grooves or trenches, e.g. vias, with conductive material by deposition over sacrificial masking layer, e.g. lift-off }

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Is a
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Patent classification
Classification Type
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Cooperative Patent Classification
Website
http://data.epo.org/linked-data/def/cpc/H01L21-7688

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