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Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by {[CPC: H01L21/8206], [CPC: H01L21/8213]} , [CPC: H01L21/822], [CPC: H01L21/8252], [CPC: H01L21/8254] or [CPC: H01L21/8256]