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H01L 2224/02233

Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body not in direct contact with the bonding area

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Edits on 16 Mar, 2022
"update inverses"
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Golden AI
edited on 16 Mar, 2022
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H01L 2224/0225
"update inverses"
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Golden AI
edited on 16 Mar, 2022
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H01L 2224/02255
"update inverses"
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Golden AI
edited on 16 Mar, 2022
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H01L 2224/0226
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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H01L 2224/02122
Edits on 5 Mar, 2022
"update inverses"
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Golden AI
edited on 5 Mar, 2022
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H01L 2224/02245
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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Description (+147 characters)
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 H01L 2224/02233

Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body not in direct contact with the bonding area

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Is a
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Patent classification
Classification Type
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Cooperative Patent Classification
Website
http://data.epo.org/linked-data/def/cpc/H01L2224-02233

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