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H01L 2224/03916

Methods of manufacturing bonding areas involving a specific sequence of method steps a passivation layer being used as a mask for patterning the bonding area

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Edits on 16 Mar, 2022
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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H01L 2224/039
Edits on 5 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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 H01L 2224/03916

Methods of manufacturing bonding areas involving a specific sequence of method steps a passivation layer being used as a mask for patterning the bonding area

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Cooperative Patent Classification
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http://data.epo.org/linked-data/def/cpc/H01L2224-03916

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