Other attributes
Classification Type
Parent Classification
No article content yet.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
H01L 2224/08147
Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the bonding area connecting to a bonding area disposed in a recess of the surface of the body
Find more entities like H01L 2224/08147
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
