H01L 2224/16168

Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being non-metallic, e.g. being an insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item