H01L 2224/1626
Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the bump connector connecting between the body and an opposite side of the item with respect to the body
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Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
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H01L 2224/1626
Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the bump connector connecting between the body and an opposite side of the item with respect to the body
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