H01L 2224/25113
Disposition the connectors being bonded to at least one common bonding area the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body
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Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
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H01L 2224/25113
Disposition the connectors being bonded to at least one common bonding area the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body
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