H01L 2224/48149
Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the wire connector connecting to a bonding area protruding from the surface
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Edits on 5 Mar, 2022
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H01L 2224/48149
Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the wire connector connecting to a bonding area protruding from the surface
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