H01L 2224/48663
Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
Name
# Contributions
Last Contribution
Find more entities like H01L 2224/48663
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
