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H01L 2224/80006

Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate

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Edits on 16 Mar, 2022

"Entity importer update"

edited on 16 Mar, 2022

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Parent classification

H01L 2224/80003

Edits on 5 Mar, 2022

"Created via: Entity Importer"

created this topic on 5 Mar, 2022

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Description (+392 characters)

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H01L 2224/80006

Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate

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Cooperative Patent Classification

Website

http://data.epo.org/linked-data/def/cpc/H01L2224-80006

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