H01L 2224/80031
Reshaping the bonding area in the bonding apparatus, e.g. flattening the bonding area by chemical means, e.g. etching, anodisation
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Edits on 5 Mar, 2022
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H01L 2224/80031
Reshaping the bonding area in the bonding apparatus, e.g. flattening the bonding area by chemical means, e.g. etching, anodisation
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