H01L 2224/819
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
All edits
Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
Edits made to:
Infobox (+4 properties)
Description (+239 characters)
H01L 2224/819
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
Infobox
Classification Type
Parent classification
Find more entities like H01L 2224/819
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
