Other attributes
Child Classification
Classification Type
Parent Classification
No article content yet.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
H01L 2224/82
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
Find more entities like H01L 2224/82
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
