H01L 2224/83102
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
All edits
Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
Edits made to:
Infobox (+3 properties)
Description (+312 characters)
H01L 2224/83102
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
Infobox
Classification Type
Find more entities like H01L 2224/83102
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
