H01L 2224/89
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups [CPC: H01L2224/81] - [CPC: H01L2224/86]
All edits
Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
Edits made to:
Infobox (+3 properties)
Description (+262 characters)
H01L 2224/89
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups [CPC: H01L2224/81] - [CPC: H01L2224/86]
Infobox
Classification Type
Find more entities like H01L 2224/89
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
