H01L 2224/90
Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
All edits
Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
Edits made to:
Infobox (+3 properties)
Description (+209 characters)
H01L 2224/90
Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
Infobox
Classification Type
Find more entities like H01L 2224/90
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
