Other attributes
Classification Type
Parent Classification
No article content yet.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
H01L 23/49513
Lead-frames {or other flat leads characterised by the die pad having bonding material between chip and die pad}
Find more entities like H01L 23/49513
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
