H01L 23/5252

Arrangements for conducting electric current within the device in operation from one component to another {, i.e. interconnections, e.g. wires, lead frames } including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections {comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive}