H01L 25/0652

Assemblies consisting of a plurality of individual semiconductor or other solid state devices {; Multistep manufacturing processes thereof} all the devices being of a type provided for in the same subgroup of groups [CPC: H01L27/00] - [CPC: H01L51/00], e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group [CPC: H01L27/00] {the devices being arranged next and on each other, i.e. mixed assemblies}