Other attributes
Classification Type
Parent Classification
No article content yet.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
Assemblies consisting of a plurality of individual semiconductor or other solid state devices {; Multistep manufacturing processes thereof} the devices being of types provided for in two or more different main groups of [CPC: H01L27/00] - [CPC: H01L49/00] {and [CPC: H01L51/00]}, e.g. forming hybrid circuits {the devices being mounted on two or more different substrates}