H01L 25/167

Assemblies consisting of a plurality of individual semiconductor or other solid state devices {; Multistep manufacturing processes thereof} the devices being of types provided for in two or more different main groups of [CPC: H01L27/00] - [CPC: H01L49/00] {and [CPC: H01L51/00]}, e.g. forming hybrid circuits {comprising optoelectronic devices, e.g. LED, photodiodes}