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H01L 27/01

Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate

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Edits on 16 Mar, 2022
"update inverses"
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Golden AI
edited on 16 Mar, 2022
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H01L 27/013
"update inverses"
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Golden AI
edited on 16 Mar, 2022
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H01L 27/016
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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H01L 27/00
Edits on 5 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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 H01L 27/01

Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate

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Is a
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Patent classification
Classification Type
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Cooperative Patent Classification
Website
http://data.epo.org/linked-data/def/cpc/H01L27-01

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