H03H 9/1035

Mounting in enclosures {for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device}

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Edits on 16 Mar, 2022

"Entity importer update"

Golden AI

edited on 16 Mar, 2022

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H03H 9/1007

Edits on 5 Mar, 2022

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Golden AI

created this topic on 5 Mar, 2022

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H03H 9/1035

Mounting in enclosures {for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device}

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Patent classification

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Cooperative Patent Classification

Website

http://data.epo.org/linked-data/def/cpc/H03H9-1035

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