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H05K 1/0204

{Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate }

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Edits on 16 Mar, 2022

"update inverses"

edited on 16 Mar, 2022

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"Entity importer update"

edited on 16 Mar, 2022

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Edits on 5 Mar, 2022

"Created via: Entity Importer"

created this topic on 5 Mar, 2022

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Description (+123 characters)

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H05K 1/0204

{Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate }

Infobox

Is a

Patent classification

Classification Type

Cooperative Patent Classification

Website

http://data.epo.org/linked-data/def/cpc/H05K1-0204

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