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H05K 2203/0733

Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls

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Edits on 16 Mar, 2022
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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H05K 2203/0703
Edits on 5 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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 H05K 2203/0733

Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls

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Cooperative Patent Classification
Website
http://data.epo.org/linked-data/def/cpc/H05K2203-0733

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