H05K 3/4069

{Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates}

Edits on 16 Mar, 2022

"Entity importer update"

edited on 16 Mar, 2022

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Edits on 5 Mar, 2022

"Created via: Entity Importer"

created this topic on 5 Mar, 2022

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{Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates}

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