Company attributes
Industry
B2X
Email Address
support@hyperpay.tech
info@hyperpay.tech
privacy@hyperpay.tech
Full Address
Tower C, TML Plaza, Tsuen Wan, Hong Kong
Investors
Total Funding Amount (USD)
40,000,000
Latest Funding Round Date
May 28, 2022
Competitors
Exchange
Latest Funding Type
Cryptocurrency attributes
Ticker Symbol
HPY
Block Explorer URL
Other attributes
Company Operating Status
Active
Strategic Partnerships
Cryptocurrency Symbol
HPY0
Latest Funding Round Amount (USD)
40,000,000
Partner Organizations
Total Supply
2,650,000,0000
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Timeline
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Funding Rounds
Products
Acquisitions
SBIR/STTR Awards
Patents
Further Resources
No Further Resources data yet.
