SBIR/STTR Award attributes
This proposal conceptualizes a double-sided cooling module for lightweight, cost-effective power converters capable of very high power densities. In this approach, the WBG die is prepackaged to access both sides of the semiconductor chip. The prepackaged die is then sandwiched between two direct bonded copper (DBC) substrates. A cooling module, featuring microconvective jet impingement liquid cooling technology, is located on each side to form the overall package that effectively cools both sides of the power converter devices. This approach combines better physics and better architectures to judiciously balance performance, weight, and cost. Additionally, the proposal will implement non-traditional cooling package material construction that has been shown to greatly reduce EMI, potentially leading to even greater savings through co-design of thermal, mechanical, electrical, and EMI optimization.
