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OZARK INTEGRATED CIRCUITS, INC. SBIR Phase I Award, August 2020

A SBIR Phase I contract was awarded to Ozark Integrated Circuits, Inc. in August, 2020 for $124,998.0 USD from the NASA.

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Contents

sbir.gov/node/1882237
Is a
SBIR/STTR Awards
SBIR/STTR Awards

SBIR/STTR Award attributes

SBIR/STTR Award Recipient
Ozark Integrated Circuits, Inc.
Ozark Integrated Circuits, Inc.
0
Government Agency
NASA
NASA
0
Award Type
SBIR0
Contract Number (US Government)
80NSSC20C02820
Award Phase
Phase I0
Award Amount (USD)
124,9980
Date Awarded
August 30, 2020
0
End Date
March 1, 2021
0
Abstract

NASA has demonstrated a resolve to land instruments on the corrosive, high-pressure (~100 bar), high-temperature (470deg;C) surface of Venus. NASA Glenn Research Centerrsquo;s JFET-R technology is the only one that has shown 1000rsquo;s of hours operation under Venus surface conditions. Due to the extreme environment found on the surface of Venus, access to reliable passive components such as resistors and capacitors to accompany JFET-R chipsets are minimal to not available. Furthermore, this has restricted design exploration into mixed signal application specific integrated circuits (ASICs) due to there dependency on off chip passive components. Ozark IC has identified additive manufacturing capabilities that would enable custom tunable resistors to accompany JFET-R analog to digital converters.The objective for this proposal is an all JFET-R based analog to digital converter with supporting passive components in a single integrated package.The project will utilize additive manufacturing techniques to create high-temperature single layer printed resistors in several different conductors. Furthermore, high-temperatures capacitors will be integrated onto the same substrate as the printed resistors. This, in combination with NASArsquo;s JFET-R technology will create a design technology which will be used to develop a analog to digital sensor node. These advancements in passive component integration should allow a library of mixed signal designs to be utilized. Once resistor materials have been selected, resistor test structures will be printed in all pastes. These designs will be evaluated at probe to 400°C as well as long term reliability testing at 500°C.

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