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Teresa M Arroyo

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Edits on 14 Dec, 2021
"Remove inverse infobox"
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edited on 14 Dec, 2021
Edits made to:
Infobox (-22 properties)
Infobox
Patent primary examiner of
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US Patent 7863740 Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof
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US Patent 7872346 Power plane and land pad feature to prevent human metal electrostatic discharge damage
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US Patent 7875968 Leadframe, semiconductor package and support lead for bonding with groundwires
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US Patent 7884375 Solar cell, uneven surface on an insulation layer as a screen mesh pattern, and manufacturing method thereof
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US Patent 7884379 Nitride semiconductor light emitting device
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US Patent 7884426 Layout design method of semiconductor integrated circuit having well supplied with potential different from substrate potential
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US Patent 7923835 Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
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US Patent 7928537 Organic electroluminescent device
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US Patent 7928549 Integrated circuit devices with multi-dimensional pad structures
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US Patent 7939843 Light emitting device and high refractive index layer
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US Patent 7944020 Reverse MIM capacitor
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US Patent 7944021 Semiconductor device with suppressed hump characteristic
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US Patent 7960845 Flexible contactless wire bonding structure and methodology for semiconductor device
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US Patent 7968967 One-time-programmable anti-fuse formed using damascene process
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US Patent 7968980 Support member for mounting a semiconductor device, conductive materials, and its manufacturing method
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US Patent 7968982 Thermal enhanced upper and dual heat sink exposed molded leadless package
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US Patent 7968989 Multi-package slot array
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US Patent 7968991 Stacked package module and board having exposed ends
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US Patent 7968997 Semiconductor device
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US Patent 7969005 Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
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US Patent 7969022 Die-to-die wire-bonding
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US Patent 7969024 Semiconductor package with joint reliability, entangled wires including insulating material
Edits on 8 Dec, 2021
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edited on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7969022 Die-to-die wire-bonding
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Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968982 Thermal enhanced upper and dual heat sink exposed molded leadless package
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968997 Semiconductor device
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968989 Multi-package slot array
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968991 Stacked package module and board having exposed ends
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968967 One-time-programmable anti-fuse formed using damascene process
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7960845 Flexible contactless wire bonding structure and methodology for semiconductor device
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7944020 Reverse MIM capacitor
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7944021 Semiconductor device with suppressed hump characteristic
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7939843 Light emitting device and high refractive index layer
Edits on 7 Dec, 2021
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7928549 Integrated circuit devices with multi-dimensional pad structures
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7928537 Organic electroluminescent device
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Golden AI
edited on 7 Dec, 2021
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Golden AI
edited on 6 Dec, 2021
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Golden AI
edited on 6 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7884379 Nitride semiconductor light emitting device
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Golden AI
edited on 6 Dec, 2021

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